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Technology Roadmap

Technology Roadmap

The information below details some of the key capabilities that Starteam can offer and support. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve. 


However if you have some specific requirements that are not shown in the table below, please feel free to contact us for a consultation. In the past our engineers have designed customized solutions for our customers' needs. 


Click here to see our patents for specific technologies and solutions.


CategoryDetails20202021
RigidLayer Countsup to 8up to 10
Line Width/ Space Inner Layer100/100µm75/75µm
Line Width/ Space Outer Layer100/100µm75/75µm
Board thickness Min/Max-D/S0.5/3.2mm0.5/3.2mm
Board thickness Min/Max- M/L0.5/3.2mm
0.5/3.2mm
Copper thicknessInner Layer204 µm204 µm
Outer Layer204 µm204 µm
FeaturesImpedance tolerance≥50Ω:±10% ,<50Ω:±5Ω ≥50Ω:±10% ,<50Ω:±5Ω
Carbon printYesYes
Depth Routing

(min.) Depth routing final remaining thickness: 0.2mm
Process control tolerance: +/-0.15mm

(min.) Depth routing final remaining thickness: 0.2mm
Process control tolerance: +/-0.075mm
Semi-Flex PCB (bendable)Yes Yes
Thermal managementAlu. substrateYes (1 Layer) (1W/3W/5W)Yes (1 Layer) (1W/3W/5W)
Delivery panel sizeMax490 X 590mm490 X 590mm
MinDepends on customers’ requirementsDepends on customers’ requirements
DrillingMin Drill bit≤2Oz:0.2mm / ≥3Oz:0.3mm≤2Oz:0.2mm / ≥3Oz:0.3mm
Laser drillingNoNo
Aspect ratio - through hole8 : 112: 1
Planned technologyHDINoNo
FlexNoNo
Rigid-FlexNoNo
Laser routing only for AluminumYesYes
LDI for solder maskNoYes

Metal Substrate Capability

PropertiesCapability
Max layer count1
Metal materialVentec, Boyu, AJU, etc
Copper thickness range17-102µm
Dielectric thickness range50-250µm
Thermal conductivity range1.0~5w/m.K
Min. line width/spacing with 1oz100/100µm
Solder mask colorWhite, Black, Green etc
Surface FinishOSP, ENIG, Immersion Tin, HAL LF
High-pot testYes
The Max voltage value (VDC or VAC)AC and DC 10KV





Surface Finishes


Surface Finishes
Thickness
In Accordance With
OSP
0.2µm (min.)
IPC-J-STD-003
ENIG
Ni: 3um (min.) Au: 0.05µm (min.)
IPC-4552
HAL LF
Thickness 1-40µm
IPC-J-STD-003
Immersion Tin
Thickness min 1µm
IPC-4554