At Starteam, we believe that quality makes the difference. In the R&D lab, it is our main focus to ensure the production processes, the material used, the end surfaces and the long-term reliability of our products – are all in the direction of zero defects.
In the single-digit DPPM range, the standard quality control during the circuit board production and the final inspection is by no means sufficient to achieve significant improvements. Rather, statistical test, evaluation methods and standardized test plate designs are required here in order to continuously measure and further improve the production process.
Examples: SIR / CAF / Wetting-Balance / cross-cut / layer registration / s-m registration / via reliability / layer registration
With this method, we achieve recurring and comparable test results with which optimization can be measured and compared directly. These results are therefore free of the effect that conventional PCB layouts come with.
These standard layouts are used to measure and continuously improve our processes, materials and defect rates, as well as potential weakness points, in cooperation with our engineers, quality experts, NPI team and specialists in our test laboratory.
Wetting balance system to examine and monitor the solderability of the end surfaces used, as well as the storage and aging resistance.
Test Panel
With regards to lead-free multiple soldering processes, this is a key issue in the interaction of the circuit board and component assembly.
In addition to our thermal shock and dump-heat test cabinets, we have invested in measuring equipment to examine and also document the reliability of the vias and the material reliability in relation to CAF and SIR under defined conditions.
Before going into production, a test pattern based on our customers’ original design is built and tested over a range of defined tests and simulations resembling different environments and a period of 10-15 years. Any potential defect in the test pattern will be detected and resolved before proceeding to the production stage.
With our tests, we can prove the reliability of your design over life time. If our customers' original design fails any of the tests, our engineers will investigate the root cause and reason for the failure – whether it’s a material or design problem. Together with our customers, we will provide solutions on how to improve on the design and run a new set of tests to prove the new set up. Once the design and construction is as robust as possible, we can proceed to mass production.
Example: Test Pattern
Physical Properties Tests for Customer Product Validation
Test projects* | Test method | Reference standard |
Bow/Twist | IPC TM 650 2.4.22 | IPC 600 or 6012 |
Thermal shock cycle | IPC TM 650 section 2.6.7 | IPC TM 650 section 2.6.7 |
High temperature storage | IPC TM650 2.4.28.1 | IPC TM650 2.4.28.1 |
Heat damp | IPC-TM-650- 2.6.3.3 | IPC TM 650 |
Wetting balance test | IPC-TM-650 2.4.14.2 | J-STD-003 |
Thermal stress | IPC -TM-650 2.6.8 | IPC 600 or 6012 |
Solderability test | IPC -TM-650 2.4.12 | IPC 600 or 6012 |
Electrical Properties Tests for Customer Product Validation
Test projects* | Test method | Reference standard |
Contact resistance | Four-wire electrical test | The resistance change must not exceed 10% compared to the initial value |
SIR | IPC TM 650 2.6.3 | IPC TM 650 |
Dielectric strength | IPC TM 650 2.5.7 | IPC 6012 3.8.1 |
Insulation resistance | IPC TM 650 2.6.3 | IPC 6012 3.10.8 |
Breakdown Voltage | IPC TM 650 2.5.6.2 | IPC TM 650 |
Hi pot test | IPC TM 650 2.5.6.1 | IPC TM 650 |
*Not only limited to these tests